Over 99.99%, ensuring minimal impurities that could affect semiconductor performance.

Extremely low levels of aluminum, calcium, and iron, usually measured in parts per million (ppm), to prevent contamination.

Below 30 ppm, as low OH content is critical for high-temperature stability.

Softening Point: Around 1710°C.

Annealing Temperature: Approximately 1220°C.

These high thermal resistance properties allow the quartz to withstand the Czochralski process used in silicon wafer production.

Over 90% transparency in the near-ultraviolet (NUV) range, which is necessary for optical components in semiconductor processes.

Virtually bubble-free to maintain consistency in quality during processing.